The LIoT project can provide companies with technologies and digitalisation piloting, integrating microcontroller and sensors into digital solutions and providing them with new business-enhancing information.The project now has the potential of 3D printing technologies for encapsulation solutions up to 20cm * 20cm. 3d printing technology makes it possible to produce durable and complex solutions for agile piloting.
Preliminary rough draft for activity monitoring sensor node case enclosure
3D CAD model created in the project
Finished 3D-printed product